If you work with soldering processes or soldered components, Principles of Soldering will help you understand and solve practical engineering challenges. Clearly written and well referenced, this book takes you from the fundamental characteristics of solders, fluxes, and joining environments to the impact these have in the selection and successful use of soldering processes. Priority is given to the fundamental principles that underlie this field of technology rather than recipes for making joints. Striking a balance between being unduly simplistic or overly mathematical in their approach, the authors provide the critical analysis that is missing from much of the literature on soldering. An entire section is devoted to the difficult art of fluxless soldering and includes strategies for devising successful processes. The final chapter is devoted to recent advances in soldering technology and covers a variety of topics including lead-free solders, flip-chip interconnection, diffusion soldering, amalgams as solders, composite solders and other “hot” areas of research. Containing approximately 200 figures and 60 tables, this book updates and greatly expands the soldering content in the book Principles of Soldering and Brazing (1993) by the same authors.
Contents:
- History of Solders and Soldering
- Joining Methods
- Key Parameters of Soldering
- Design and Application of Soldering Processes
- Solders and Their Metallurgy
- Effect of Metallic Impurities
- Application of Phase Diagrams to Soldering
- Eutectic Alloying
- Joining Atmospheres
- Fluxes for Soldering
- Fluxless Soldering
- The Role of Materials in Defining Process Constraints
- Metallurgical and Mechanical Constraints
- Advances in Soldering Technology
- Lead-Free Solders
- Flip-Chip Interconnection
- Test Methods and Calibration Standards
- Amalgams
- Strengthening of Solders
- Reinforced Solders
- Solders Doped with Rare Earth Elements
- Diffusion Soldering
- Advances in Joint Characterization Techniques
- Plus Appendices, References, and Index